A high-performance thermal interface material designed for enthusiasts, overclockers, and professionals. This innovative 30g thermal putty is a flexible and efficient alternative to traditional thermal pads, specifically engineered to handle height variations and deliver consistent thermal conductivity.
🔧 Key Features:
-
🛠 Superior Thermal Transfer
Ensures optimal heat dissipation across components like VRAM and SMDs, ideal for water-cooled GPU builds. -
🔌 Electrically Non-Conductive
Safe for sensitive electronics—no risk of short circuits. -
🔄 Flexible Gap Filling
Compensates for surface height differences from 0.2 mm to 3.0 mm, outperforming most thermal pads. -
🧴 Easy Application
Comes with 3 precision spatulas for even, clean distribution—no mess, no stress. -
🌡 Wide Operating Range
Stable and effective from -40°C to +120°C, perfect for demanding environments. -
🔄 Replaces Traditional Pads
Ideal for replacing multiple thermal pads in GPU and high-performance systems.
The Thermal Grizzly Putty Advance 30g (TG-P-A-030-R) is the go-to solution for those seeking superior heat dissipation with flexibility and ease of use. Whether you’re optimizing GPU cooling or fine-tuning a custom loop setup, TG Putty delivers unmatched thermal performance. Upgrade your cooling game with Thermal Grizzly’s trusted innovation.
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler.
TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for broad application, while by hand, it can be shaped into small pellets tailored to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm.
TG Putty is available in three variants, primarily differing in their thermal conductivity:
- TG Putty Basic: Medium thermal conductivity
- TG Putty Advance: Good thermal conductivity
- TG Putty Pro: Excellent thermal conductivity
For modifying a single, smaller graphics card without an active backplate (e.g., GeForce GTX 1060), approximately one 30-gram container of TG Putty is required. For larger graphics cards, such as a GeForce RTX 4090, one 30-gram container is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the backside, there is often a uniform, larger gap between the PCB and the backplate on larger graphics cards. In this case, approximately two 30-gram containers are needed to completely fill this gap.
Notes:
TG Putty is not suitable for use on processors (IHS or Direct Die) or directly on the GPU die!
Before application, the target surface should be thoroughly cleaned and degreased, for example, using TG Cleaning Wipes or conventional isopropanol.
Scope of Delivery
- Thermal Putty Advanced
- 3x Spatulas
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